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 TECHNICAL DATA
IN74HC30A
8-Input NAND Gate
The IN74HC30A is high-speed Si-gate CMOS device and is compatible with low power Schottky TTL (LSTTL) . The device provide the 8-input NAND function. * Outputs Directly Interface to CMOS, NMOS, and TTL * Operating Voltage Range: 2.0 to 6.0 V * Low Input Current: 1.0 A * High Noise Immunity Characteristic of CMOS Devices
ORDERING INFORMATION IN74HC30AN Plastic IN74HC30AD SOIC TA = -55 / 125 C for all packages
LOGIC DIAGRAM
A B
PIN ASSIGNMENT
A
1 2 3 4 5 6 7
14 13 12 11 10 9 8
V CC
C D Y E F G H
B C D E F GND
H G -. Y
PIN 14 =VCC PIN 7 = GND A L X X X X X X X H B X L X X X X X X H X X L X X X X X H
FUNCTION TABLE
Inputs D X X X L X X X X H E X X X X L X X X H F X X X X X L X X H G X X X X X X L X H H X X X X X X X L H Output Y H H H H H H H H L
X = don't care
1
IN74HC30A
MAXIMUM RATINGS*
Symbol VCC VIN VOUT IIN IOUT ICC PD Tstg TL Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP** SOIC Package** Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) Value -0.5 to +7.0 -1.5 to VCC +1.5 -0.5 to VCC +0.5 20 25 50 750 500 -65 to +150 260 Unit V V V mA mA mA mW C C
*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. **Derating - Plastic DIP: - 10 mW/C from 65 to 125C SOIC Package: : - 7 mW/C from 65 to 125C
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VIN, VOUT TA tr, tf Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1) VCC =2.0 V VCC =4.5 V VCC =6.0 V Min 2.0 0 -55 0 0 0 Max 6.0 VCC +125 1000 500 400 Unit V V C ns
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND(VIN or VOUT)VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
2
IN74HC30A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Symbol Parameter Test Conditions VCC V Guaranteed Limit 25 C to -55C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9 2.48 3.98 5.48 0.1 0.1 0.1 0.26 0.26 0.26 -0.1 0.1 2.0 85 C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9 2.34 3.84 5.34 0.1 0.1 0.1 0.33 0.33 0.33 -1.0 1.0 20 125 C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9 2.20 3.70 5.20 0.1 0.1 0.1 0.4 0.4 0.4 -1.0 1.0 40 A A A V V Unit
VIH
Minimum High-Level Input Voltage
VOUT0.1V or VOUT VCC-0.1V IOUT 20 A VOUT0.1V or VOUT VCC-0.1V IOUT 20 A VIN=VIH or VIL IOUT - 20 A VIN= VIH or VIL IOUT - 2.4 mA VIN= VIH or VIL IOUT - 4.0 mA VIN= VIH or VIL IOUT - 5.2 mA
2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 4.5 6.0 3.0 4.5 6.0 2.0 4.5 6.0 3.0 4.5 6.0 6.0 6.0 6.0
VIL
Maximum Low -Level Input Voltage
V
VOH
Minimum High-Level Output Voltage
V
VOL
Maximum Low-Level Output Voltage
VIN= VIH or VIL IOUT 20 A VIN= VIH or VIL IOUT 2.4 mA VIN= VIH or VIL IOUT 4.0 mA VIN= VIH or VIL IOUT 5.2 mA VIN= 0 V VIN= VCC VIN=VCC or 0 V IOUT=0 A
IIL IIH ICC
Maximum Low-Level Input Leakage Current Maximum High-Level Input Leakage Current Maximum Quiescent Supply Current (per Package)
3
IN74HC30A
AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input tr=tf=6.0 ns)
VCC Symbol Parameter V Guaranteed Limit 25 C to -55C 175 35 30 75 15 13 10 85C 125C Unit
tPHL, tPLH
Maximum Propagation Delay (Figure 1)
2.0 4.5 6.0 2.0 4.5 6.0 5.0
220 44 37 95 19 16 10
265 53 45 110 22 19 10
ns
tTHL, tTLH
Maximum Output Transition Time (Figure 1) Maximum Input Capacitance Power Dissipation Capacitance (Per Gate)
ns
CIN
pF
TA=25C,VCC=5.0 V 27 pF
CPD
Used to determine the no-load dynamic power consumption: PD=CPDVCC2f+ICCVCC
tf
0.9
tr V1
0.9
Input
V2 0.1 0.1
V2
GND tPHL VCC
tPLH
0.9 V2 0.1
0.9 V2 0.1
Output
0V
tTLH
tTHL
V1 = VCC V2 = 0.5 VCC
Figure 1. Switching Waveforms
VCC
VI PULSE GENERATOR RT DEVICE UNDER TEST
VO
Termination resistance RT - should be equal to ZOUT of pulse generators
CL 50 pF
Figure 2. Test Circuit
4
IN74HC30A
N SUFFIX PLASTIC DIP (MS - 001AA)
A 14 8 B 1 7
Dimension, mm Symbol A B C MIN 18.67 6.1 MAX 19.69 7.11 5.33 0.36 1.14 2.54 7.62 0 2.92 7.62 0.2 0.38 10 3.81 8.26 0.36 0.56 1.78
F
L
D F
C -T- SEATING N G D 0.25 (0.010) M T K
PLANE
G H
H J
M
J K L M N
NOTES: 1. Dimensions "A", "B" do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side.
D SUFFIX SOIC (MS - 012AB) Dimension, mm
8
A 14
Symbol A
MIN 8.55 3.8 1.35 0.33 0.4 1.27 5.27 0 0.1 0.19 5.8 0.25
MAX 8.75 4 1.75 0.51 1.27
H
B
P
B C
1
G
7 C R x 45
D F G
-TD 0.25 (0.010) M T C M K
SEATING PLANE
H
J F M
J K M P R
8 0.25 0.25 6.2 0.5
NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B 0.25 mm (0.010) per side.
5


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